datasheet low phase noise zero dela y buffer and multiplier ics670-02 idt? / ics? low phase noise zero delay buffer and multiplier 1 ics670-02 rev h 110409 description the ics670-02 is a high speed, low phase noise, zero delay buffer (zdb) which integrates idt?s proprietary analog/digital phase locked loop (pll) techniques. part of idt?s clockblocks tm family, the part?s zero delay feature means that the rising edge of the input clock aligns with the rising edges of the outputs giving the appearance of no delay through the device. there are two identical outputs on the chip. the fbclk should be used to connect to the fbin. each output has its own output enable pin. the ics670-02 is ideal for synchronizing outputs in a large variety of systems, from personal computers to data communications to video. by allowing off-chip feedback paths, the chip can eliminate the delay through other devices. the 15 different on-chip multipliers work in a variety of applications. for other multipliers, including functional multipliers, see the ics527. features ? packaged in 16-pin soic ? available in pb (lead) free package ? clock inputs from 5 to 160 mhz (see page 2) ? patented pll with low phase noise ? output clocks up to 160 mhz at 3.3 v ? 15 selectable on-chip multipliers ? power down mode available ? low phase noise: -111 dbc/hz at 10 khz ? output enable function tri-states outputs ? low jitter 15 ps one sigma ? advanced, low power, sub-micron cmos process ? operating voltage of 3.3 v or 5 v ? industrial temperature range available (-40 to +85c) note: eol for non-green parts to occur on 5/13/10 per pdn u-09-01 block diagram divide by n voltage controlled oscillator fbclk oe1 phase detector, charge pump, and loop filter fbin s3:s0 iclk clk2 4 oe2 vdd 3 gnd 3 external feedback from fbclk is recommended.
ics670-02 low phase noise zero delay buffer and multiplier zdb and multiplier idt? / ics? low phase noise zero delay buffer and multiplier 2 ics670-02 rev h 110409 pin assignment multiplier select table pin descriptions 12 1 11 2 10 3 9 vdd 4 vdd 5 vdd 6 gnd 7 clk2 8 oe2 gnd s0 s1 fbclk s3 oe1 iclk 16 15 14 13 fbin gnd s2 s3 s2 s1 s0 clk2 (and fbclk) input range (mhz) 0000 low (power down entire chip) - 0001 input x1.333 18 - 120 0010 i nput x6 5 - 26.67 0011 input x1.5 16.67 - 107 0100 input x3.333 7.5 - 48 0101 input x2.50 10 - 64 0110 i nput x4 6 - 40 0111 i nput x1 25 - 160 1000 input x2.333 11 - 69 1001 input x2.666 10 - 60 1010 i nput x12 5 - 13.33 1011 i nput x3 8 - 53.33 1100 i nput x10 5 - 16 1101 i nput x5 6 - 32 1110 i nput x8 5 - 20 1111 i nput x2 12 - 80 pin number pin name pin type pin description 1 - 3 vdd input power supply. connect both pins to the same voltage (either 3.3 v or 5 v). 4 clk2 output clock output from vco. output frequency equals the input frequency times multiplier. 5 oe2 input output clock enable 2. tri-states the clock 2 output when low. 6 fbclk output clock output from vco. output frequency equals the input frequency times multiplier. 7 oe1 input output clock enable 1. tri-states the feedback clock output when low. 8 fbin input feedback clock input. 9 iclk input clock input. connect to a 5 - 160 mhz clock. 10 s3 input multiplier select pin 3. determines outputs per table above. internal pull-up. 11 s2 input multiplier select pin 2. determines outputs per table above. internal pull-up. 12 s1 input multiplier select pin 1. determines outputs per table above. internal pull-up. 13 s0 input multiplier select pin 0. determines outputs per table above. internal pull-up. 14 - 16 gnd power connect to ground.
ics670-02 low phase noise zero delay buffer and multiplier zdb and multiplier idt? / ics? low phase noise zero delay buffer and multiplier 3 ics670-02 rev h 110409 external components the ics670-02 requires a minimum number of external components for proper operation. decoupling capacitors of 0.01f should be connected between vdd and gnd on pins 4 and 5, and vdd and gnd on pins 13 and 12, as close to the device as possible. a series termination resistor of 33 ? may be used to each clock output pin to reduce reflections. absolute maximum ratings stresses above the ratings listed below can cause permanent damage to the ics670-02. these ratings, which are standard values for idt commercially rated parts, are stress ratings only. functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for exte nded periods can affect product reliability. electrical parameters are guaranteed only over the recommended operating temperature range. recommended operation conditions dc electrical characteristics vdd=3.3 v 10%, ambient temperature -40 to +85 c, unless stated otherwise item rating supply voltage, vdd 7 v all inputs and outputs -0.5 v to vdd+0.5 v ambient operating temperature 0 to +70 c storage temperature -65 to +150 c junction temperature 150 c soldering temperature 260 c parameter min. typ. max. units ambient operating temperature 0 +70 c power supply voltage (measured in respect to gnd) +3.0 +5.5 v parameter symbol conditions min. typ. max. units operating voltage vdd 3.0 5.5 v input high voltage v ih 2v input low voltage v il 0.8 v output high voltage v oh i oh = -12 ma 2.4 v output low voltage v ol i ol = 12 ma 0.4 v output high voltage, cmos level v oh i oh = -4 ma vdd-0.4 v operating supply current idd no load 35 ma
ics670-02 low phase noise zero delay buffer and multiplier zdb and multiplier idt? / ics? low phase noise zero delay buffer and multiplier 4 ics670-02 rev h 110409 ac electrical characteristics vdd = 3.3v 10%, ambient temperature -40 to +85 c, unless stated otherwise note 1: rising edge of iclk compared with rising edge of clk2, with fbclk connected to fbin, and 15 pf load on clk2. thermal characteristics short circuit current i os each output 50 ma internal pull-up resistor r pu oe, select pins 200 k ? input capacitance c in oe, select pins 5 pf parameter symbol conditions min. typ. max. units parameter symbol conditions min. typ. max. units input clock frequency f in see table on page 2 5 160 mhz output clock frequency 160 mhz output rise time t or 0.8 to 2.0 v, no load 1.5 ns output fall time t of 2.0 to 0.8 v, no load 1.5 ns output clock duty cycle t dc measured at vdd/2 45 50 55 % input to output skew note 1 100 ps maximum absolute jitter short term 45 ps maximum jitter one sigma 15 ps phase noise, relative to carrier, 125 mhz (x5) 100 hz offset -103 dbc/hz 1 khz offset -117 dbc/hz 10 khz -111 dbc/hz 200 khz -88 dbc/hz parameter symbol conditions min. typ. max. units thermal resistance junction to ambient ja still air 120 c/w ja 1 m/s air flow 115 c/w ja 3 m/s air flow 105 c/w thermal resistance junction to case jc 58 c/w
ics670-02 low phase noise zero delay buffer and multiplier zdb and multiplier idt? / ics? low phase noise zero delay buffer and multiplier 5 ics670-02 rev h 110409 phase noise for 125 mhz out put, 25 mhz clock input (vdd = 3.3 v) -140 -120 -100 -80 -60 -40 -20 0 10e+0 100e+0 1e+3 10e+3 100e+3 1e+6 10e+6 ics670-02 phase noise 3.3 v, 25 in 125 out
ics670-02 low phase noise zero delay buffer and multiplier zdb and multiplier idt? / ics? low phase noise zero delay buffer and multiplier 6 ics670-02 rev h 110409 package outline and package dimensions (16-pin soic, 150 mil. narrow body) package dimensions are kept current with jedec publication no. 95 ordering information *note: eol for non-green parts to occur on 5/13/10 per pdn u-09-01 parts that are ordered with a "lf" su ffix to the part number are the pb-fr ee configuration and are rohs compliant. while the information presented herein has been checked for both accuracy and reliability, integrated device technology (idt) a ssumes no responsibility for either its use or for the infringement of any paten ts or other rights of third parties, which would resul t from its use. no other circuits, patents, or licenses are im plied. this product is intended for use in normal commercial applications. any other applications such as those requiring extended temperature range, high reliab ility, or other extraordinary environmental requirements are not recommended without additional processing by idt. idt reserves th e right to change any circuitry or specifications without noti ce. idt does not authorize or warrant any idt product for use in life support devices or critical medical instruments. part / order number marking shipping packaging package temperature 670m-02* ics670m-02 tubes 16-pin soic 0 to +70 c 670M-02T* ics670m-02 tape and reel 16-pin soic 0 to +70 c 670m-02lf 670m-02lf tubes 16-pin soic 0 to +70 c 670m-02lft 670m-02lf tape and reel 16-pin soic 0 to +70 c 670mi-02lf 670mi-02lf tubes 16-pin soic -40 to +85 c 670mi-02lft 670mi-02lf tape and reel 16-pin soic -40 to +85 c index area 1 2 16 d e seating plane a1 a e - c - b .10 (.004) c c l h h x 45 millimeters inches symbol min max min max a 1.35 1.75 .0532 .0688 a1 0.10 0.25 .0040 .0098 b 0.330.51.013.020 c 0.19 0.25 .0075 .0098 d 9.80 10.00 .3859 .3937 e 3.80 4.00 .1497 .1574 e 1.27 basic 0.050 basic h 5.80 6.20 .2284 .2440 h 0.250.50.010.020 l 0.401.27.016.050 0 8 0 8
? 2006 integrated device technology, inc. all rights reserved. product specifications subject to change without notice. idt and the idt logo are trademarks of integrated device technology, inc. accelerated thinking is a service mark of integrated device technology, inc. all other brands, product names a nd marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. printed in usa corporate headquarters integrated device technology, inc. www.idt.com for sales 800-345-7015 408-284-8200 fax: 408-284-2775 for tech support www.idt.com/go/clockhelp innovate with idt and accelerate your future netw orks. contact: www.idt.com ics670-02 low phase noise zero delay buffer and multiplier zdb and multiplier
|
